AMB (Active Metal Brazing) is a specialized welding technique that enables high-strength joining of ceramics to metals. Its fundamental principle lies in using a brazing filler metal containing small amounts of active elements (such as Ti or Zr), which chemically reacts with the ceramic surface at elevated temperatures to form a reactive interfacial layer that can be thoroughly wetted by the molten filler metal.

RF channels require extremely low dielectric loss and a stable dielectric constant, while the digital control layer demands high Tg, high thermal resistance, and cost-effectiveness. An all-high-frequency laminate solution offers excellent performance but at an excessively high cost, whereas an all-FR-4 solution suffers from rapidly deteriorating loss above 3 GHz. Hybrid laminate PCBs have emerged in this context and have become the mainstream architecture for 5G RF boards.

The value of diamond in the semiconductor industry is thus undergoing a structural reconfiguration—from traditionally serving as a wafer-processing consumable material reliant on its ultra-high hardness, to evolving into a core thermal management functional material that directly supports chips during their operational phase, leveraging its exceptional thermal conductivity.

Recently, due to rising market demand, core upstream raw materials such as glass fabric and copper foil have become increasingly scarce, leading to significant price increases. Therefore, per company notification, effective immediately (August 19, 2026), material prices will be adjusted as follows: Product (all thicknesses) – Adjustment幅度 FR-4: +10% PP: +20%

HDI (High Density Interconnect) printed circuit boards, centered on laser-drilled microvias and multilayer sequential lamination technology, are specifically designed for efficient fan-out routing of fine-pitch VFBGA chips. The industry uses HDI build-up levels (e.g., HDI‑1, HDI‑2, HDI‑3, etc.) to indicate the manufacturing complexity.

The industry has established multiple mature ceramic metallization technology routes, primarily including the molybdenum-manganese sintering method, various electroplating processes (gold plating, copper plating, nickel plating, tin plating), laser-assisted plating (LAP), direct bond copper (DBC), and active metal brazing (AMB). Different ceramic substrates exhibit significant variations in surface characteristics, crystal structure, and thermal properties, resulting in distinct metallization processes, processing parameter windows, and application scenarios best suited for each. The following sections systematically elaborate on the metallization principles, key parameters, and technical characteristics for the four most commonly used ceramic substrate types in industrial applications.