Baineng Yunban 6-Layer HDI Rigid-Flex PCB: The Perfect Integration of High Density and High Reliability

In today's era where smart devices continuously pursue thinness and performance, traditional PCBs struggle to meet the demands of complex scenarios. BaiNeng YunBoard’s new 6-layer HDI rigid-flex board redefines the possibilities of high-density interconnects through innovative structure and cutting-edge manufacturing processes.

Precision composite structure: Combines a 4-layer HDI rigid board with a 2-layer flex board, offering both structural rigidity and flexible bending capabilities—perfectly suited for spatial connection scenarios like folding mechanisms and hinges.

Advanced process specifications:

Total thickness of only 1.6mm, ultra-thin and compact, freeing up more internal space within devices

Minimum via diameter of 0.1mm and minimum BGA pitch of 0.2mm, enabling high-density chip layouts

Rigid board trace/space down to 4/4mil; flex board down to 2.5/2.5mil, ensuring precise signal transmission

Premium substrate assurance: A combination of Shengyi S7136H and Taimicron FPCL substrates delivers excellent electrical performance and mechanical flexibility, ideal for demanding operating conditions.

6-layer HDI rigid-flex board

Core product advantages

Ultra-precise layout for high-density applications

With an ultra-small via diameter of 0.1mm, minimum BGA pitch of 0.2mm, and fine trace/space specifications (4/4mil on rigid sections, 2.5/2.5mil on flex sections), this 6-layer HDI rigid-flex board enables extremely dense circuit layouts. It reliably handles complex signal transmission and power delivery requirements, providing essential support for miniaturized and highly integrated electronic devices.

Dual-substrate synergy for dual performance assurance

By integrating Shengyi S7136H rigid substrate with Taimicron FPC flex substrate, the design ensures stable circuit structure and superior electrical performance in rigid areas, while the flex sections provide bendability, foldability, and adaptability to 3D spatial configurations—balancing mechanical strength with flexible integration to effortlessly handle complex installation environments.

Integrated structure breaking form limitations

The innovative integrated structure—combining a 4-layer HDI rigid board with a 2-layer flex board—enables flexible interconnections between boards and modules without additional connectors. This significantly reduces connection losses, enhances signal transmission stability, simplifies internal assembly processes, and lowers both production and maintenance costs.

Flagship application cases

Case 1: Domain Controller for a Leading Automotive Manufacturer

Challenge: The automotive domain controller needed to integrate multiple high-definition cameras and radar data processing modules within a confined space, while enduring continuous vibration and extreme temperature fluctuations during vehicle operation.

Solution: BaiNeng YunBoard’s 6-layer HDI rigid-flex board was deployed, using the flex section for 3D routing to flexibly connect high-performance computing chips with sensor interface modules—ensuring signal integrity and enhancing overall vibration resistance.

Result: The product passed automotive-grade reliability tests and operates stably across a temperature range of -40℃ to 85℃, enabling the automaker to implement L2+ advanced driver-assistance systems (ADAS) in multiple mass-produced vehicle models.

Case 2: Industrial-Grade Drone Gimbal Control Board

Challenge: Drone gimbals require frequent pitch and rotation movements while transmitting high-definition video signals and control commands—traditional rigid boards cannot withstand repeated bending or high-altitude vibrations.

Solution: BaiNeng YunBoard’s 6-layer HDI rigid-flex board was selected, with the flex section serving as the dynamic interconnect at the gimbal hinge and the rigid section housing core control chips—achieving full 3D spatial routing.

Result: After 100,000 bending cycles, signal integrity remained uncompromised; the gimbal maintained stable footage even in Level 7 wind conditions, helping the client increase its market share by 20% in the industrial drone segment.

Case 3: Main Control Board for a Premium Foldable Smartphone

Challenge: Foldable smartphones must integrate complex functionalities—including 5G, fast charging, and advanced imaging—within an ultra-thin profile, while the folding hinge must endure over 200,000 bending cycles.

Solution: BaiNeng YunBoard’s 6-layer HDI rigid-flex board utilized two flex layers as the core interconnect at the folding hinge and four rigid layers to host chips and interfaces, with trace/space precision down to 2.5/2.5mil for high-density integration.

Result: The board successfully passed 200,000-cycle folding reliability validation, enabling the client to achieve a thinner, lighter, and longer-lasting foldable smartphone—becoming a key competitive advantage in flagship models.

Why choose BaiNeng YunBoard?

Technical expertise: Deep experience in the PCB industry with mastery of core HDI rigid-flex manufacturing processes, enabling high-precision, high-reliability mass production

Customization services: Flexible adjustment of layer count, trace/space dimensions, and substrate materials based on specific customer application scenarios to perfectly match product requirements

Quality assurance: Rigorous quality control throughout the entire production process and compliance with multiple industry certifications ensure stable operation of every board—even under extreme conditions

Proven track record: Successfully implemented in flagship projects across automotive, drone, and consumer electronics sectors, earning strong recognition from leading global clients

Whether it’s enabling safe driving in intelligent vehicles, high-altitude flight for drones, or premium user experiences in foldable smartphones, BaiNeng YunBoard’s 6-layer HDI rigid-flex board delivers extreme density and reliable performance—serving as the foundational cornerstone for your product innovation.

Choose BaiNeng YunBoard for a more efficient, reliable, and competitive PCB solution!