PCB upstream materials have "risen across the board."

Since late February 2026, the electronic materials sector has experienced a wave of price hikes driven by rising costs of base raw materials. Core materials such as copper-clad laminates (CCL), prepregs (PP), and ultra-fine fiber base fabrics have seen successive price increases, rapidly transmitting cost pressures downstream to PCB manufacturing and electronic end-products.

I. Core Material Price Hikes Intensify, with Multiple Companies Issuing Price Adjustment Notices

Summary of Electronic Material Price Increases (February–March 2026)

Copper-Clad Laminates and Related Materials Lead the Price Increases

Starting February 25, Meizhou Wilibang Electronics and Fujian Lihao Electronics successively raised prices for HB, 22F, CEM-1, and other CCL models by 5–8 RMB per sheet, citing sustained increases in the prices of fiberglass cloth, copper foil, and chemical raw materials.

From March 10 onward, price increases expanded further: Jiangxi Hongruixing Technology raised prices by 10% across its CCL and prepreg product lines due to simultaneous shortages and price surges in fiberglass cloth, copper foil, and resin—an overall increase of 10%;

Affected by Middle East tensions causing epoxy resin supply shortages and price spikes, Shandong Jinbao Electronics increased CEM-1/22F CCL prices by 10 RMB per sheet;

Industry leader Guangdong Kingboard Laminates simultaneously announced that due to elevated costs of epoxy resin, natural gas, and copper, prices for all laminate thicknesses, prepregs, and copper foil processing fees would be uniformly increased by 10%.

Ultra-Fine Fiber Base Fabric Faces “Second Wave” of Price Hikes

On March 10, Shanghai Huafon Microfiber issued a notice that effective March 16—on top of its March 9 price increase—it would uniformly raise prices for ultra-fine fiber base fabrics of various thicknesses by an additional 2–6 RMB per meter, attributing this to soaring international crude oil prices driving upstream raw material cost increases and supply tightness.

More Companies Announce Price Hikes Effective March 15–16

Due to sharp copper price increases and severe fiberglass cloth shortages, Wuxi Hongren Electronics raised prices for core base materials and prepregs by 15% overall;

Nanya Plastics’ Electronic Materials Division also announced that, impacted by rising copper foil processing fees and ongoing shortages of electronic-grade fiberglass cloth, it would increase prices for copper-clad laminates and prepregs by 15%.

This wave of price increases has been ongoing for some time. On March 11, Golden Dragon Group Technology informed customers that its CCL products had cumulatively risen by approximately 55% since late August 2025, and warned that raw material prices might rise further due to Middle East tensions, leaving room for additional product price increases.

III. Costs Transmitted Downstream; PCB Makers and End Brands Respond

Cost increases have now precisely propagated down the supply chain to the PCB manufacturing stage, exerting significant pressure on production and profitability.

End markets have swiftly implemented countermeasures: on March 10, OPPO became the first to announce that due to rising costs of key components, it would adjust prices for certain smartphone models effective March 16. According to channel reports, leading brands including vivo, Xiaomi, iQOO, and Honor have also finalized plans to implement new rounds of product price adjustments in March, demonstrating the ongoing transmission of cost pressures throughout the supply chain.